Liquid ejection head and process for producing the same

A process for producing a liquid ejection head that comprises a recording element substrate for discharging a liquid, an electrical wiring substrate provided with a wiring for transmitting a signal for ejecting the liquid to the recording element substrate, a plurality of wiring wires for connecting a connection terminal of the recording element substrate and the wiring of the electrical wiring substrate, a support member provided with a concavity for support the recording element substrate and with a joining surface that is provided in an outer edge portion of the concavity and joined to the electrical wiring substrate, and a sealant control wall that is arranged between a side surface on a side on which the connection terminal of the recording element substrate is provided and a side surface of the support member extending crosswise from an end portion on a side of the joining surface on which side the wiring wires are arranged and extends along an arrangement direction of the plurality of wiring wires, the process comprising:

• preparing a liquid ejection head in which the concavity and the recording element substrate are fixed to each other, the joining surface and the electrical wiring substrate are fixed to each other, and the wire conductors and the connection terminal are connected with each other;
• and
• filling a sealant between the side surface of the recording element substrate and a side surface of the sealant control wall on the side of the recording element substrate followed by filling the sealant between a side surface of the sealant control wall on the side of the wiring wires and the wiring wires.

A liquid ejection head comprising:

• a recording element substrate for discharging a liquid;
• an electrical wiring substrate connected to a connection terminal of the recording element substrate and provided with a plurality of lead terminals for transmitting a signal for ejecting the liquid;
• a support member provided with a concavity for supporting the recording element substrate and with a joining surface that is provided in an outer edge portion of the concavity and joined to the electrical wiring substrate;
• a sealant for covering a connecting portion between the connection terminal of the recording element substrate and the lead terminals;
• and
• a sealant control wall that is arranged between a side surface on a side on which the connection terminal of the recording element substrate is provided and a side surface of the support member extending crosswise from an end portion on that side of the joining surface on which the lead terminals are arranged and extends along an arrangement direction of the plurality of lead terminals.