Back to results
US 2013/0155142 A1Published application
Thermal sensing fluid ejection assembly and method
AssigneeHewlett-Packard Development Company, L.P.
InventorsRobert N. K. Browning, James Gardner, Eric Martin, Andrew L. Van Brocklin, Mark Hunter
Life of this patent
Estimating the term…
Abstract
A fluid ejection assembly includes a fluid slot formed in a die. The assembly also includes a nozzle column is formed along a side of the fluid slot. The assembly also includes a pair of thermal sensors to measure die temperature at the middle of the nozzle column and at a first end of the nozzle column.
Claims15
A fluid ejection assembly comprising:
- a fluid slot formed in a die;
- a nozzle column along a side of the fluid slot;
- and
- a pair of thermal sensors to measure die temperature at the middle of the nozzle column and at a first end of the nozzle column.
1 more element
A method of creating a thermal profile across a fluid ejection die assembly, comprising:
- sensing a first temperature and a second temperature of a die at a first location and a second location, respectively, of the die;
- generating an error signal proportional to a temperature difference between the first and second temperatures;
- and
- in response to the error signal, heating the die at whichever location has a cooler temperature.
1 more element
A thermal inkjet printing system comprising:
- a fluid ejection die having a fluid supply slot and a nozzle column to eject fluid drops;
- and
- a heating system disposed on the die to maintain a temperature profile across the surface of the die through selective application of heat to different areas of the die in response to temperature data sensed at the different areas of the die.
Dependencies are inferred from the claim text.