US 2013/0154760 A1 · BONDING WIRE IMPEDANCE MATCHING CIRCUIT

Abstract

An impedance matching circuit is provided. The present impedance matching circuit is able to match impedance using a transformer which is arranged inside a dielectric substrate and arranged to overlap with a bonding pad area and an end of a transmission line, thereby enabling transmitting signals at a desired frequency with a minimum insertion loss without using a very thin transmission line which is several to dozens of μm wide or specially designed antennas in order to compensate for inductance. Thus, the present impedance matching circuit may be applied to various millimeter bands.

Claims8

Dependent claims

An impedance matching circuit comprising:

a dielectric substrate;
a ground arranged on a lower surface of the dielectric substrate;
a first pad which is arranged on an upper surface of the dielectric substrate, and to which bonding wires is connected;
a transmission line which is arranged on an upper surface of the dielectric substrate, and of which an end is arranged by a certain distance from the first pad;
and
a second pad which is arranged inside the dielectric substrate, and is arranged to overlap with the first pad area and an end area of the transmission line.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

13/716,406Filed 17 Dec 2012

Priority

KR 10-2011-013523615 Dec 2011

Published

20 Jun 2013

Term ends

Not estimatedThe source records don’t support an estimate.

Classification4 codes

H03H 7/38
Multiple-port networks comprising only passive electrical elements as network components: impedance-matching networks
H01P 5/028
Transitions between lines of the same kind and shape, but with different dimensions: between strip lines
H03H
Impedance networks
H01P
Waveguides

Bonding wire impedance matching circuit

Life of this patent

Bonding wire impedance matching circuit

Life of this patent

Abstract

Claims8