Waveguide, interposer substrate including the same, module, and electronic apparatus
AssigneeSony Corporation
InventorsShinya Morita, Koichi Ikeda, Akira Akiba, Mitsuo Hashimoto
Life of this patent
Estimating the term…
Abstract
A waveguide includes: a waveguide portion including a first surface and a second surface that are opposed to each other; a first transmission line provided on the first surface of the waveguide portion; a second transmission line provided on the second surface of the waveguide portion; and a first conversion structure inputting a signal from the first transmission line to the waveguide portion and converting the signal.
Claims11
A waveguide, comprising:
- a waveguide portion including a first surface and a second surface that are opposed to each other;
- a first transmission line provided on the first surface of the waveguide portion;
- a second transmission line provided on the second surface of the waveguide portion;
- and
- a first conversion structure inputting a signal from the first transmission line to the waveguide portion and converting the signal.
An interposer substrate with an insulating substrate and a waveguide provided in the substrate, the waveguide comprising:
- a waveguide portion including a first surface and a second surface that are opposed to each other;
- a first transmission line provided on the first surface of the waveguide portion;
- a second transmission line provided on the second surface of the waveguide portion;
- and
- a first conversion structure inputting a signal from the first transmission line to the waveguide portion and converting the signal.
A module with an interposer substrate and a semiconductor chip, the interposer substrate being provided with a waveguide in an insulating substrate, and the semiconductor chip being mounted on the interposer substrate, the waveguide comprising:
- a waveguide portion including a first surface and a second surface that are opposed to each other;
- a first transmission line provided on the first surface of the waveguide portion;
- a second transmission line provided on the second surface of the waveguide portion;
- and
- a first conversion structure inputting a signal from the first transmission line to the waveguide portion and converting the signal.
An electronic apparatus with an interposer substrate, a semiconductor chip, and a mounted substrate, the interposer substrate being provided with a waveguide in an insulating substrate, the semiconductor chip being mounted on the interposer substrate, and the mounted substrate being electrically connected with the interposer substrate, the waveguide comprising:
- a waveguide portion including a first surface and a second surface that are opposed to each other;
- a first transmission line provided on the first surface of the waveguide portion;
- a second transmission line provided on the second surface of the waveguide portion;
- and
- a first conversion structure inputting a signal from the first transmission line to the waveguide portion and converting the signal.
Dependencies are inferred from the claim text.