Apparatus and Method for Thermal Interfacing
AssigneeEmblation Limited
InventorsGary Beale, Eamon McErlean
Life of this patent
Estimating the term…
Abstract
An apparatus (20) for use as an amplifier has a transistor (26) for providing signal amplification, a heat pipe or circulated fluid heat sink (22) and a thermal interface device (24) for providing mechanical and thermal connection between the transistor (26) and the heat sink (22). In use, to facilitate efficient transfer of heat/thermal energy from the transistor (26) to the heat sink (22), the plate (24) is provided between the heat sink (22) and the transistor (26). The plate (24) connects the heat sink (22) to the transistor (26) and provides a thermal conduit therebetween.
Claims27
An apparatus for use as an amplifier comprising:
- a radio frequency or microwave transistor for providing signal amplification;
- at least one circuit board to provide input signals to and/or receive signals from the transistor;
- and
- a thermal interface device configured to facilitate mechanical and thermal connection between the transistor and a heat pipe heat sink or circulating fluid heat sink.
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
A thermal interface device configured to engage with a radio frequency or microwave transistor and to facilitate mechanical and thermal connection between the transistor and a heat pipe heat sink or circulating fluid heat sink.
A method of thermally interfacing a transistor and a heat sink for use in an amplifier, comprising the steps:
- providing a transistor for providing signal amplification;
- providing at least one circuit board to provide input signals to and receive signals from the transistor;
- and
- providing a thermal interface device configured to facilitate mechanical and thermal connection between the transistor and a microprocessor heat pipe heat sink or a microprocessor circulating fluid heat sink.
Dependencies are inferred from the claim text.