US 2013/0154203 A1 · DEVICE FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES AND GRIPPING PIN FOR USE IN THE DEVICE

Abstract

A device for processing wafer-shaped articles comprises a rotary chuck having a series of pins adapted to hold a wafer shaped article on the rotary chuck. Each of the pins comprises a cylindrical body and a projecting gripping portion formed integrally therewith. The cylindrical body and gripping portion are made from a ceramic material. The gripping portion comprises cylindrical surfaces having a common generatrix with surfaces of the cylindrical body.

Claims15

Dependent claims

Device for processing wafer-shaped articles, comprising a rotary chuck having a series of pins adapted to hold a wafer shaped article on said rotary chuck, each of said pins comprising a cylindrical body and a projecting gripping portion formed integrally therewith and being of a ceramic material, said gripping portion comprising cylindrical surfaces having a common generatrix with surfaces of said cylindrical body.

Dependencies are inferred from the claim text.

Facts

Application

13/328,212Filed 16 Dec 2011

Published

20 Jun 2013

Term ends

Not estimatedThe source records don’t support an estimate.

Classification6 codes

H10P 72/7608
The wafers being placed on a susceptor, stage or support: characterised by a plurality of separate clamping members, e.g. clamping fingers
H10P 72/0414
For wet cleaning or washing: using mainly spraying means, e.g. nozzles
H10P 72/7624
The wafers being placed on a susceptor, stage or support: characterised by the mechanical construction of the susceptor, stage or support
Y10T 279/17213
Socket type: transversely oscillating jaws

Device for treating surfaces of wafer-shaped articles and gripping pin for use in the device

Life of this patent

Device for treating surfaces of wafer-shaped articles and gripping pin for use in the device

Life of this patent

Abstract

Claims15