Electronic Device And Method Of Making
AssigneeTexas Instruments Incorporated
InventorsSteven Kummerl, Richard J. Saye
Life of this patent
Estimating the term…
Abstract
Circuits and methods of fabricating circuits are disclosed herein. A method of fabricating an electronic circuit includes placing an electronic component on a substrate. A ferromagnetic material is mixed into a mold compound to produce a mixed mold compound having an increased permeability over the mold compound. The mixed mold compound is applied to the substrate by way of a transfer mold process, wherein the mixed mold compound encapsulates the electronic component.
Claims20
A method of fabricating an electronic circuit, said method comprising:
- placing an electronic component on a substrate;
- mixing a ferromagnetic material into a mold compound to produce a mixed mold compound having an increased permeability over the mold compound;
- applying said mixed mold compound to said substrate by way of a transfer mold process, wherein said mixed mold compound encapsulates said electronic component.
A transfer mold compound mixture for use in a transfer mold device to encapsulate electronic components, said transfer mold compound mixture comprising a mold compound and at least one ferromagnetic material.
A method of fabricating inductors, said method comprising:
- forming a plurality of coils on a substrate;
- mixing a ferromagnetic material with a transfer mold compound to provide a mixed transfer mold compound;
- applying said mixed transfer mold compound to said coil via a transfer mold process to encapsulate said plurality of coils;
- and
- singulating individual ones of the encapsulated coils into individual inductors.
Dependencies are inferred from the claim text.