Anisotropic conductive film and semiconductor device bonded by the same
AssigneeCheil Industries Inc.
InventorsKyung Il SUL, Dong Seon UH, Nam Ju KIM, Kyoung Soo PARK, Young Woo PARK, Joon Mo SEO, Arum YU, Hyun Min CHOI
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Abstract
A semiconductor device bonded by an anisotropic conductive film and an anisotropic conductive film composition, the anisotropic conductive film including a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq; a hydrogenated epoxy resin; and a sulfonium cation curing catalyst.
Claims17
A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film comprising:
- a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq;
- a hydrogenated epoxy resin;
- and
- a sulfonium cation curing catalyst.
A semiconductor device bonded by a rapid low-temperature curable anisotropic conductive film, the rapid low-temperature curable anisotropic conductive film comprising:
- a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq, and
- a sulfonium cation curing catalyst,
- wherein the rapid low-temperature curable anisotropic conductive film has a curing rate of about 80% or more when cured at 150 to 170° C. for 5 seconds.
Dependencies are inferred from the claim text.