Automatic Place and Route Method for Electromigration Tolerant Power Distribution
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChung-Hsing Wang, King-Ho Tam, Huang-Yu Chen
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChung-Hsing Wang, King-Ho Tam, Huang-Yu Chen
Estimating the term…
The present disclosure relates to an electromigration tolerant power distribution network generated by an automatic place and route (APR) methodology. In some embodiments, an automatic place and route tool constructs a local power network having multi-level power rails. The multi-level power rails have interleaved segments of vertically adjacent metal layers, wherein each interleaved segment is shorter than a predetermined characteristic length corresponding to a Blech length. By limiting the length of the interleaved metallization segments, electromigration within the multi-level power rails is alleviated, allowing for the maximum current density requirement (Jmax) for mean time to failures (MTTF) to be increased.
An auto place and route method, comprising:
An integrated chip, comprising:
An auto place and route method, comprising:
Dependencies are inferred from the claim text.