Microspring Structures Adapted for Target Device Cooling

A thermal and electrical contact structure for contacting a pad structure, comprising:

• a substrate;
• an electrical contact pad formed on said substrate;
• a plurality of electrical microspring structures, each said electrical microspring structure formed over said substrate and comprising an anchor portion and a free portion, the anchor portion being fixed to said substrate and in electrical communication with said electrical contact pad, the free portion having a non-planar profile, the free portion being free to move relative to said substrate;
• a plurality of thermal microspring structures, each said thermal microspring structure formed over said substrate, of thermally conductive material, and comprising an anchor portion and a free portion, the anchor portion being fixed to said substrate and in thermal communication therewith, the free portion having a non-planar profile, the free portion being free to move relative to said substrate;
• said plurality of thermal microspring structures defining a plurality of thermal transfer fluid receiving channels;
• and
• said electrical and thermal microsprings configured such that when said thermal and electrical structure is positioned proximate said pad structure each said electrical microspring makes physical and electrical contact with an electrical contact pad of said pad structure and each said thermal microspring makes physical and thermal contact with said pad structure to permit thermal conduction between said pad structure and said thermal and electrical contact structure.

A contact and pad structure assembly, comprising:

• thermal and electrical contact structure, comprising:
• a substrate;
• an electrical contact pad formed on said substrate;
• an electrical microspring structure formed over said substrate and comprising an anchor portion and a free portion, the anchor portion being fixed to said substrate and in electrical communication with said electrical contact pad, the free portion having a non-planar profile, the free portion being free to move relative to said substrate;
• and
• a thermal element formed of thermally conductive material, formed over said substrate, and configured such that when said thermal and electrical structure is positioned proximate said pad structure with said electrical microspring making electrical contact with an electrical contact pad of said pad structure said thermal element is in physical contact with said pad structure to permit thermal conduction between said pad structure and said thermal and electrical contact structure;
• a pad structure, comprising:
• a substrate;
• a semiconductor die having an electrical contact pad;
• a thermal contact region;
• said thermal and electrical contact structure and said pad structure disposed relative to one another such that said electrical microspring makes physical and electrical contact with said electrical contact pad and said thermal element makes physical and thermal contact with said thermal contact region of said pad structure to permit thermal conduction between said pad structure and said thermal and electrical contact structure.