Semiconductor device

Abstract

A semiconductor device is provided which can change electrode pads of a semiconductor chip which are allocated to balls without any increase in the number of wires and without any change in a substrate. The semiconductor device includes a semiconductor chip having first and second electrode pads, and a package substrate on which the semiconductor chip is mounted. The package substrate includes a first stitch having a width larger than widths of first and second wires, a second stitch having a width larger than the widths of the first and second wires, a ball that can be coupled with an external, the first wire that couples the first stitch and the ball, and the second wire that couples the first stitch and the second stitch. A first bonding wire couples the first stitch and the first electrode pad, or the second stitch and the second electrode pad.

Dependencies are inferred from the claim text.