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US 2013/0154125 A1Published application
Adhesive film and electronic device including the same
AssigneeCheil Industries Inc.
InventorsHye Jin KIM, Jae Won CHOI, Ji Ho KIM, Jin Man KIM, Gyu Seok SONG
Life of this patent
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Abstract
An adhesive film includes an amine curing agent and a phenolic curing agent, and has a ratio of a storage modulus at 170° C. after 80% or more curing to a storage modulus at 40° C. before curing in the range of about 1.5 to about 3.0.
Claims17
An adhesive film, comprising:
- an amine curing agent;
- and
- a phenolic curing agent,
- wherein, the adhesive film has a ratio of a storage modulus at 170° C. after 80% or more curing to a storage modulus at 40° C. before curing in the range of about 1.5 to about 3.0.
1 more element
An adhesive film, comprising:
- an amine curing agent;
- and
- a phenolic curing agent,
- the adhesive film having a die-shear strength of 9 kgf or more after curing at 125° C. for 1 hour and at 175° C. for 1 hour, and a storage modulus at 170° C. of 5.0×106 dyne/cm2 or more after 80% curing.
1 more element
An adhesive film, comprising:
- a binder resin;
- an epoxy resin;
- a filler;
- an amine curing agent;
- and
- a phenolic curing agent,
- wherein a mole % ratio of the amine curing agent to the phenolic curing agent ranges from about 0.3 to about 10.
4 more elements
Dependencies are inferred from the claim text.