Semiconductor Device and Fabrication Method

A semiconductor device, comprising:

• a carrier;
• a semiconductor chip disposed over a first side of the carrier;
• a layer stack disposed between the carrier and the semiconductor chip or over a second side of the carrier opposite the semiconductor chip, or both, the layer stack comprising a plurality of electrically insulating layers, each electrically insulating layer comprising a laminate comprising an electrically insulating matrix material and a mechanically stabilizing material embedded in the electrically insulating matrix material.

A method of fabricating a semiconductor device, the method comprising:

• disposing a semiconductor chip over a first side of a carrier;
• disposing a layer stack over the first side of the carrier between the carrier and the semiconductor chip or over a second side of the carrier opposite the semiconductor chip, or both, the layer stack comprising at least a first electrically insulating layer, the first electrically insulating layer comprising a laminate comprising a first electrically insulating matrix material and a first mechanically stabilizing material embedded in the first electrically insulating matrix material.