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US 2013/0154122 A1Published application
Semiconductor chip with underfill anchors
AssigneesATI Technologies ULC, Advanced Micro Devices, Inc.
InventorsRoden Topacio, Neil McLellan
Life of this patent
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Abstract
Various semiconductor chips and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in an insulating layer applied to a side of a semiconductor chip. The first opening does not extend through to the side. A second opening is formed in the insulating layer that exposes a portion of the side.
Claims20
An apparatus, comprising:
- a semiconductor chip including a side and plural solder structures to enable semiconductor the semiconductor chip to flip-chip mounted to a circuit board;
- a first insulating layer on the side;
- a second insulating layer on the first insulating layer and including a first opening that does not extend through to the first insulating layer and a second opening that extends at least to the first insulating layer.
An apparatus, comprising:
- a semiconductor chip including a side and plural conductor pads on the side;
- a first insulating layer on the side;
- a second insulating layer on the first insulating layer, the second insulating layer including plural first openings that do not extend through to the first insulating layer and plural second openings that extend at least to the first insulating layer, each of the second openings extending to one of the conductor pads.
An apparatus, comprising:
- a circuit board;
- a semiconductor chip coupled to the circuit board and having a side facing the circuit board, the side being separated from the circuit board by a gap;
- a first insulating layer on the side;
- a second insulating layer on the first insulating layer, the second insulating layer including plural first openings that do not extend through to the first insulating layer and plural second openings that extend at least to the first insulating layer;
- and
- an underfill in the gap and including a projection positioned in each of the first openings.
3 more elements
Dependencies are inferred from the claim text.