Integrated circuit packaging system with package-on-package and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsByung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua
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Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a peripheral lead; forming an interior conductive layer directly on the peripheral lead; forming a vertical connector directly on the interior conductive layer, the vertical connector having a connector top side; connecting an integrated circuit to the interior conductive layer; and forming an encapsulation over the integrated circuit, the encapsulation having an encapsulation top side coplanar with the connector top side.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- forming a peripheral lead;
- forming an interior conductive layer directly on the peripheral lead;
- forming a vertical connector directly on the interior conductive layer, the vertical connector having a connector top side;
- connecting an integrated circuit to the interior conductive layer;
- and
- forming an encapsulation over the integrated circuit, the encapsulation having an encapsulation top side coplanar with the connector top side.
A method of manufacture of an integrated circuit packaging system comprising:
- forming a peripheral lead;
- forming an interior conductive layer directly on the peripheral lead;
- forming a vertical connector directly on the interior conductive layer, the vertical connector having a connector top side;
- connecting an integrated circuit to the interior conductive layer;
- forming an encapsulation over the integrated circuit, the encapsulation having an encapsulation top side coplanar with the connector top side;
- and
- forming an insulation layer directly on the peripheral lead.
An integrated circuit packaging system comprising:
- a peripheral lead;
- an interior conductive layer directly on the peripheral lead;
- a vertical connector directly on the interior conductive layer, the vertical connector having a connector top side;
- an integrated circuit connected to the interior conductive layer;
- and
- an encapsulation over the integrated circuit, the encapsulation having an encapsulation top side coplanar with the connector top side.
Dependencies are inferred from the claim text.