Integrated circuit packaging system with terminals and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsByung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua
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Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a lead having a lead top side; forming a lower interior conductive layer directly on the lead top side; forming an interior insulation layer directly on the lower interior conductive layer; forming an upper interior conductive layer directly on the interior insulation layer; and mounting an integrated circuit over the upper interior conductive layer.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- forming a lead having a lead top side;
- forming a lower interior conductive layer directly on the lead top side;
- forming an interior insulation layer directly on the lower interior conductive layer;
- forming an upper interior conductive layer directly on the interior insulation layer;
- and
- mounting an integrated circuit over the upper interior conductive layer.
A method of manufacture of an integrated circuit packaging system comprising:
- forming a lead having a lead top side;
- forming a lower interior conductive layer directly on the lead top side;
- forming an interior insulation layer directly on the lower interior conductive layer;
- forming an upper interior conductive layer directly on the interior insulation layer;
- mounting an integrated circuit over the upper interior conductive layer;
- and
- forming a protection layer directly on a lower layer bottom side of the lower interior conductive layer.
An integrated circuit packaging system comprising:
- a lead having a lead top side;
- a lower interior conductive layer directly on the lead top side;
- an interior insulation layer directly on the lower interior conductive layer;
- an upper interior conductive layer directly on the interior insulation layer;
- and
- an integrated circuit over the upper interior conductive layer.
Dependencies are inferred from the claim text.