Integrated circuit packaging system with contacts and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsByung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: forming an isolated contact having a contact protrusion; forming a die paddle, adjacent to the isolated contact, having a die paddle contour; depositing a contact pad on the contact protrusion; coupling an integrated circuit die to the contact protrusion; molding an encapsulation on the integrated circuit die; and depositing an organic filler on and between the isolated contact and the die paddle, the contact protrusion extended past the organic filler.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- forming an isolated contact having a contact protrusion;
- forming a die paddle, adjacent to the isolated contact, having a die paddle contour;
- depositing a contact pad on the contact protrusion;
- coupling an integrated circuit die to the contact protrusion;
- molding an encapsulation on the integrated circuit die;
- and
- depositing an organic filler on and between the isolated contact and the die paddle, the contact protrusion extended past the organic filler.
A method of manufacture of an integrated circuit packaging system comprising:
- forming an isolated contact having a contact protrusion, the contact protrusion having a lower protrusion surface, an upper protrusion surface, a protrusion sidewall, and a protrusion recess in the lower protrusion surface;
- forming a die paddle, adjacent to the isolated contact, having a die paddle contour;
- depositing a contact pad on the contact protrusion;
- forming an internal connection pad on the isolated contact over the contact protrusion;
- connecting an integrated circuit die to the internal connection pad with a bond wire;
- molding an encapsulation on the integrated circuit die;
- and
- depositing an organic filler between the isolated contact and the die paddle, the contact protrusion extended past the organic filler.
An integrated circuit packaging system comprising:
- an isolated contact having a contact protrusion;
- a die paddle, adjacent to the isolated contact, having a die paddle contour;
- a contact pad on the contact protrusion;
- an integrated circuit die coupled to the contact protrusion;
- an encapsulation on the integrated circuit die;
- and
- an organic filler on and between the isolated contact and the die paddle, the contact protrusion extended past the organic filler.
Dependencies are inferred from the claim text.