Stacked die in die bga package

A die assembly, comprising:

• a first die mounted to a substrate, the first die comprising a recess extending from a surface of the first die on a side opposing a side on which the substrate is located into the first die, the recess being defined by at least two sides and a bottom surface;
• a second die at least partially received within the recess and secured to the first die;
• and
• a third die secured to the second die on a side of the second die opposing a side on which the first die is located, the third die comprising a non-rectangular cross-sectional shape, wherein the third die comprises a recess around an entire periphery of the third die and on a side distal from circuitry of the third die.

A method of fabricating a semiconductor device, comprising:

• disposing an adhesive element in a cavity defined by at least two sides and a bottom surface extending into a first die, wherein a height of the adhesive element does not add to an effective height of the first die;
• mounting the first die to a substrate with the cavity facing the substrate;
• and
• securing a second die to the first die on a side of the first die opposing a side on which the substrate is located, wherein the second die comprises a T-shaped cross-sectional shape and a recess defined at a periphery of the second die defines a space between the first die and the second die.

A method of fabricating a semiconductor device, comprising:

• disposing an adhesive element in a cavity extending into a first die, wherein a height of the adhesive element does not increase a height of the semiconductor device;
• adhering the first die to a substrate using the adhesive element with the cavity facing the substrate;
• mounting a second die on a side of the first die opposing a side on which the cavity is located, wherein the second die comprises a non-rectangular cross-sectional shape defining a space between an active surface of the first die and a recessed surface of the second die;
• and
• electrically connecting the first die to the substrate using bond wires extending from the active surface of the first die, beyond the space defined between the first and second dice, to the substrate.

A method of fabricating a semiconductor device, comprising:

• mounting a first die on a substrate, wherein the first die comprises a recess extending into the first die on a side of the first die opposing a side on which the substrate is located;
• at least partially inserting a second die into the recess and securing the second die to the first die, wherein an active surface of the second die is on a side of the second die opposing a side on which the first die is located;
• securing a third die to the active surface of the second die, wherein the third die comprises a non-rectangular cross-sectional shape defining an opening between the second and third dice;
• and
• electrically connecting the second die to the substrate using conductive elements extending from the active surface of the second die, beyond the opening defined between the second and third dice, to the substrate.

A method of fabricating a semiconductor device, comprising:

• mounting a first die on a substrate, wherein an active surface of the first die faces the substrate and the first die comprises an inner cavity extending into the first die on a side opposing a side on which the substrate is located;
• partially inserting a second die within the inner cavity of the first die with an active surface of the second die facing away from the first die, wherein a portion of the second die extends above the inner cavity;
• and
• securing the second die to the first die.