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US 2013/0154116 A1Published application
Integrated circuit packaging system with perimeter antiwarpage structure and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorDaeSik Choi
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system comprising: providing a package carrier; mounting an integrated circuit to the package carrier; and forming a perimeter antiwarpage structure on and along a perimeter of the package carrier.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a package carrier;
- mounting an integrated circuit to the package carrier;
- and
- forming a perimeter antiwarpage structure on and along a perimeter of the package carrier.
1 more element
A method of manufacture of an integrated circuit packaging system (100) comprising:
- providing a package carrier;
- mounting an integrated circuit to the package carrier;
- forming a perimeter antiwarpage structure on and along a perimeter of the package carrier;
- and
- mounting a mounting integrated circuit packaging system above the integrated circuit packaging system.
2 more elements
An integrated circuit packaging system comprising:
- a package carrier;
- an integrated circuit mounted to the package carrier;
- and
- a perimeter antiwarpage structure formed on and along a perimeter of the package carrier.
1 more element
Dependencies are inferred from the claim text.