Integrated circuit packaging system with leads and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system comprising:

• forming a lead having a lead bottom body, a lead top body, and a lead top conductive layer directly on the lead top body, the lead top conductive layer having a top protrusion and a top non-vertical portion, the lead bottom body having a horizontally contiguous structure;
• connecting an integrated circuit to the top protrusion;
• and
• forming an encapsulation covering the integrated circuit and exposing a top non-vertical upper side of the top non-vertical portion, the encapsulation coplanar with the top non-vertical upper side.

An integrated circuit packaging system comprising:

• a lead having a lead bottom body, a lead top body, and a lead top conductive layer directly on the lead top body, the lead top conductive layer having a top protrusion and a top non-vertical portion, the lead bottom body having a horizontally contiguous structure;
• an integrated circuit connected to the top protrusion;
• and
• an encapsulation covering the integrated circuit and exposing a top non-vertical upper side of the top non-vertical portion.