Direct write interconnections and method of manufacturing thereof

A method of manufacturing a semiconductor device package comprising:

• providing a substrate structure;
• attaching at least one semiconductor device to the substrate structure, each of the at least one semiconductor devices including a substrate composed of a semiconductor material and at least one connection pad formed on the substrate;
• direct writing a dielectric material onto the at least one semiconductor device and onto the substrate structure so as to form a conformal dielectric layer, the dielectric material being selectively deposited via the direct writing so as to form a one or more via openings in the conformal dielectric layer at locations corresponding to the at least one connection pad;
• and
• forming an interconnect structure on the conformal dielectric layer that is electrically coupled to the at least one connection pad of the at least one semiconductor device, the interconnect structure extending through the via openings in the dielectric layer so as to be connected to the at least one connection pad.

A semiconductor device package comprising:

• a substrate structure;
• semiconductor devices attached to the substrate structure, with each of the semiconductor devices including a substrate composed of a semiconductor material and one or more connection pads formed on the substrate;
• a conformal dielectric layer formed over and around the semiconductor devices, the conformal dielectric layer including one or more vias formed therethrough;
• and
• an interconnect structure electrically coupled to the plurality of connection pads of the semiconductor devices, the interconnect structure extending through the vias formed through the conformal dielectric layer so as to be connected to the connection pads;
• wherein the conformal dielectric layer is applied via a direct write application such that the dielectric layer conforms to the semiconductor devices and fills in gaps present between the semiconductor devices.