Integrated circuit packaging system with routable trace and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system comprising:

• providing a leadframe;
• forming routable traces on the leadframe, the routable traces include a top plate mounted thereon with a portion of the routable traces completely covering a side of the top plate facing the routable traces;
• mounting an integrated circuit partially over the routable traces;
• forming an encapsulation over and around the routable traces and the integrated circuit;
• etching the leadframe to electrically isolate at-he lead from a further lead;
• forming a hole through the encapsulation to the top plate;
• and
• forming a protective coat directly on a side of the routable traces facing opposite of the top plate.

An integrated circuit packaging system comprising:

• routable traces having top plate mounted thereon, a portion of the routable traces completely covering a side of the top plate facing the routable traces;
• an integrated circuit partially over the routable traces;
• an encapsulation over and around the routable traces and the integrated circuit, the encapsulation having a hole through the encapsulation to the top plate;
• and
• a protective coat directly on a side of the routable traces facing opposite the top plate.