Integrated circuits and methods of forming conductive lines and conductive pads therefor
AssigneeMicron Technology, Inc.
InventorRoger W. Lindsay
Life of this patent
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Abstract
An integrated circuit includes circuitry, a first conductor coupled to the circuitry, a conductive pad coupled to the first conductor, and a second conductor coupled to the conductive pad. The second conductor would be floating but for its coupling to the conductive pad. The second conductor may be spaced apart from the first conductor by a distance that is substantially equal to a width of a merged spacer that was formed from a merging of single sidewall spacers over a conductive material from which the first and second conductors were formed.
Claims20
An integrated circuit, comprising:
- circuitry;
- a first conductor coupled to the circuitry;
- a conductive pad coupled to the first conductor;
- and
- a second conductor coupled to the conductive pad;
- wherein the second conductor would be floating but for its coupling to the conductive pad;
- and
- wherein the second conductor is spaced apart from the first conductor by a distance that is substantially equal to a width of a merged spacer that was formed from a merging of single sidewall spacers over a conductive material from which the first and second conductors were formed.
An integrated circuit, comprising:
- circuitry;
- a first conductor coupled to the circuitry;
- a first conductive pad coupled to the first conductor;
- a second conductor coupled to the first conductive pad, wherein the second conductor would be floating but for its coupling to the conductive pad;
- and
- a second conductive pad, wherein the second conductive pad is commonly coupled to third and fourth conductors, wherein the third conductor is coupled to other circuitry of the integrated circuit device and the fourth conductor would be floating but for its coupling to the second conductive pad;
- wherein the second conductor is spaced apart from the first conductor by a distance that is substantially equal to a width of a merged spacer that was formed from a merging of first single sidewall spacers over a conductive material from which the first, second, third, and fourth conductors were formed;
- wherein the third conductor is spaced apart from the fourth conductor by a distance that is substantially equal to a width of a second single spacer that was formed over the conductive material from which the first, second, third, and fourth conductors were formed.
An integrated circuit, comprising:
- circuitry;
- a first conductor coupled to the circuitry;
- a first conductive pad coupled to the first conductor;
- a second conductor coupled to the first conductive pad, wherein the second conductor would be floating but for its coupling to the conductive pad;
- and
- a second conductive pad, wherein the second conductive pad is commonly coupled to third and fourth conductors, wherein the third conductor is coupled to other circuitry of the integrated circuit device and the fourth conductor would be floating but for its coupling to the second conductive pad;
- wherein a portion of the second conductor is spaced apart from a portion of the fourth conductor by a distance that is substantially equal to a width of a merged spacer that was formed from a merging of single sidewall spacers over a conductive material from which the first, second, third, and fourth conductors were formed.
Dependencies are inferred from the claim text.