Semiconductor package having multi pitch ball land
AssigneeSamsung Electronics Co., Ltd.
InventorsTong-Suk KIM, Heung-Kyu KWON, Jeong-Oh HA, Hyun-A KIM
Life of this patent
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Abstract
A semiconductor device having a printed circuit board and a semiconductor chip. The printed circuit board includes a chip region, a plurality of first ball lands adjacent to the chip region, and at least one second ball land adjacent to the first ball lands. The semiconductor chip is mounted on the chip region. The first ball lands are arranged to have a first pitch. One of the first ball lands which is nearest to the second ball land, and the second ball land have a second pitch greater than the first pitch.
Claims11
A semiconductor device, comprising:
- a first printed circuit board including a chip region defined by at least a first boundary and a second boundary, a plurality of first lands arranged in a straight line outside the chip region, and at least one second land adjacent to the intersection of the first boundary and the second boundary;
- and
- a first semiconductor chip on the chip region,
- wherein the plurality of first lands are arranged to have a first pitch, and
- wherein the second land and one of the plurality of first lands which is nearest to the second land have a second pitch that is greater than the first pitch.
A printed circuit board (PCB), comprising:
- a chip region defined by at least a first boundary and a second boundary;
- a plurality of first lands arranged in a straight line outside the chip region;
- and
- at least one second land adjacent to the intersection of the first boundary and the second boundary,
- wherein the plurality of first lands are arranged to have a first pitch, and
- wherein the second land and one of the plurality of first lands which is nearest to the second land have a second pitch that is greater than the first pitch.
Dependencies are inferred from the claim text.