Semiconductor device and its manufacture method

A semiconductor device comprising:

• a support substrate;
• chips mounted on the support substrate and having pads formed over an upper surface thereof;
• first insulating films, each of which is formed over each of the chips;
• first conductive plugs connected to the pads and disposed in the first insulating films;
• filler material made of resin filling a space between the chips and defining a flat surface together with an upper surface of the first insulating film;
• a second insulating film disposed over the first insulating film and the filler material;
• second conductive plugs disposed in the second insulating film and connected to the first conductive plugs, the second conductive plugs being smaller in horizontal cross-sectional area than the first conductive plugs;
• and
• wirings formed over the second insulating film and interconnecting pads of different chips via the second conductive plug and the first conductive plug.