US 2013/0154099 A1Published application

Pad over interconnect pad structure design

AssigneeSemiconductor Components Industries, LLC

InventorsStevan G. Hunter, Bryce A. Rasmussen, Troy L. Ruud

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Abstract

A design rule checker that performs a maximum pattern density check in a first intermediary metallization layer that underlies a top metallization layer and a pad opening in an integrated circuit. The maximum pattern density check is performed at least under some circumstances if a modulus of the primary metallization material is less than a modulus of a surrounding dielectric material. The maximum pattern density check verifies that the pattern density within the underlying portion is below a maximum pattern density that depends on the thickness of the access pad. A maximum metal width check may also be performed in this portion.

Claims20

Dependent claims

A computer program product comprising one or more computer-storage media having thereon computer-executable instructions that are structured such that, when executed by one or more processors of the computing system, cause the computing system to perform a method for assisting in a design of an electrical circuit, the method comprising:

an act of identifying a pad opening for at least one of a plurality of access pads that are in and/or above a top metallization layer of the electrical circuit;
an act of identifying 1) a first intermediary metallization layer that is a neighboring metallization layer to the top metallization layer, and 2) a first portion of the first intermediary metallization layer that underlies the pad opening of an access pad;
an act of identifying a primary metallization material of the first intermediary metallization layer;
an act of identifying surrounding dielectric material that intermediates between the top metallization layer and the first intermediary metallization layer,
wherein the computer-executable instructions are further structured such that, when executed by the one or more processors, the computing system is caused to operate a design rule checker that is configured to perform a maximum pattern density check at least under some circumstances when the identified primary metallization material has a modulus less than a modulus of the surrounding dielectric material, the maximum pattern density check verifying whether a pattern density of the first portion is below a maximum pattern density, the pattern density of the first portion being a ratio of metal area in the first portion to a total area of the first portion, the maximum pattern density depending on a thickness of the access pad.

2 more elements

A method for designing an electrical circuit, the method comprising:

an act of identifying a pad opening for at least one of a plurality of access pads that are in and/or above a top metallization layer of the electrical circuit;
an act of identifying a first intermediary metallization layer that is a neighboring metallization layer to the top metallization layer;
an act of identifying a metallization pattern to be inserted into a first portion of the first intermediary metallization layer, the first portion underlying the pad opening, wherein a design rule checker verifies that a pattern density of the metallization pattern is less than a maximum pattern density that depends on a thickness of the overlying access pad, a pattern density of the metallization pattern being a ratio of metal area in the first portion to the total area of the first portion,
wherein a primary portion of the metallization in the metal area in the first portion has a modulus less than a modulus of surrounding dielectric material that intermediates between the top metallization layer and the first intermediary metallization layer.

1 more element

Dependencies are inferred from the claim text.