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US 2013/0154094 A1Published application
Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device
AssigneeCheil Industries Inc.
InventorsKyoung Hun Shin, Do Hyun Park, Hyun Joo Seo, Young Ju Shin, Kang Bae Yoon
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Abstract
A semiconductor device is bonded by an anisotropic conductive film composition. The anisotropic conductive film composition includes an ethylene-vinyl acetate copolymer, a polyurethane resin, and organic fine particles. The anisotropic conductive film composition has a melt viscosity of about 2,000 to about 8,000 Pa·s at 80° C.
Claims8
A semiconductor device bonded by an anisotropic conductive film composition, the anisotropic conductive film composition comprising:
- an ethylene-vinyl acetate copolymer;
- a polyurethane resin;
- and
- organic fine particles;
- wherein the anisotropic conductive film composition has a melt viscosity of about 2,000 to about 8,000 Pa·s at 80° C.
2 more elements
A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including:
- an ethylene-vinyl acetate copolymer;
- a polyurethane resin;
- and
- organic fine particles;
- wherein the anisotropic conductive film has an adhesive strength of about 1,000 gf/cm or more after pressing at 150° C. and 4 MPa for 4 seconds.
2 more elements
Dependencies are inferred from the claim text.