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US 2013/0154093 A1Published application
Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device bonded by the same
AssigneeCheil Industries Inc.
InventorsArum YU, Nam Ju KIM, Kyoung Soo PARK, Young Woo PARK, Joon Mo SEO, Kyung Il SUL, Dong Seon UH, Hyun Min CHOI
Life of this patent
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Abstract
An anisotropic conductive film composition for bonding an electronic device may include a hydrogenated bisphenol A epoxy monomer represented by Formula 1 or a hydrogenated bisphenol A epoxy oligomer represented by Formula 2: where n may be an integer from 1 to about 50.
Claims18
A semiconductor device bonded by an anisotropic conductive film composition, the anisotropic conductive film composition comprising:
- a first component that includes one or more selected from the group of a hydrogenated bisphenol A epoxy monomer represented by Formula 1 and a hydrogenated bisphenol A epoxy oligomer represented by Formula 2:
- wherein n is an integer from 1 to about 50;
- a sulfonium curing agent;
- a binder resin;
- and
- conductive particles.
3 more elements
A semiconductor device bonded by an anisotropic conductive film formed from a composition, the composition comprising:
- a hydrogenated bisphenol A epoxy monomer represented by Formula 1 or a hydrogenated bisphenol A epoxy oligomer represented by Formula 2:
- wherein n is an integer from 1 to about 50,
- the anisotropic conductive film having:
- a curing rate of about 70% or more when cured at about 150 to about 170° C. for about 5 to about 10 seconds, and
- a glass transition temperature of about 120° C. or more.
2 more elements
Dependencies are inferred from the claim text.