Integrated circuit packaging system with conductive pillars and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system (100) comprising:

• providing a package carrier;
• mounting an integrated circuit to the package carrier;
• mounting an integrated circuit interposer above the integrated circuit;
• mounting a mounting integrated circuit above the circuit interposer;
• forming a conductive pillar to the circuit interposer adjacent to the mounting integrated circuit;
• connecting the circuit interposer to the package carrier;
• and
• forming an encapsulation on the package carrier.

An integrated circuit packaging system comprising:

• a package carrier;
• an integrated circuit mounted to the package carrier;
• a circuit interposer mounted above the integrated circuit;
• a mounting integrated circuit mounted above the circuit interposer;
• a conductive pillar formed to the circuit interposer adjacent to the mounting integrated circuit;
• the circuit interposer connected to the package carrier;
• and
• an encapsulation formed on the package carrier.