Semiconductor device packaging using encapsulated conductive balls for package-on-package back side coupling

A packaged device assembly comprising:

• an electronic device;
• an interconnect assembly comprising
• a substrate,
• a plurality of signal conduits embedded in the substrate and extending to a first major surface of the substrate,
• a substrate interconnect formed on the substrate and electrically coupling two or more of the plurality of signal conduits, and
• one or more conductive balls electrically coupled to the substrate interconnect at a second major surface of the interconnect assembly;
• encapsulant over and around the electronic device and over and around the interconnect assembly and forming an encapsulated region of the packaged device assembly, wherein
• a portion of the encapsulant is removed to expose a portion of the one or more conductive balls on a top surface of the packaged device assembly;
• and
• a first interconnect structure formed on the bottom surface of the packaged device assembly, wherein
• the exposed portions of the conductive balls are electrically coupled to the first interconnect structure by one or more of the substrate interconnect and a signal conduit of the one or more signal conduits.

A packaged device assembly comprising:

• encapsulant forming an encapsulated region of the packaged device assembly;
• one or more electrical contacts on a first major surface of the packaged device assembly, wherein the electrical contacts comprise exposed portions of conductive balls encapsulated in the encapsulant;
• and
• a package interconnect structure formed on a second major surface of the packaged device assembly, wherein
• a conductive ball of the conductive balls is electrically coupled to the package interconnect structure by an internal interconnect, and
• the internal interconnect is encapsulated in the encapsulant.