Bump including diffusion barrier bi-layer and manufacturing method thereof
AssigneeResearch & Business Foundation Sungkyunkwan University
InventorsHoojeong Lee, Byunghoon Lee
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Abstract
Provided herein is a bump including a diffusion barrier bi-layer, the bump having: a conductive layer; a first diffusion barrier layer formed on or above the conductive layer, and comprising an alloy of nickel and phosphorus; a second diffusion barrier formed on or above the first diffusion barrier layer, and comprising copper; and a solder layer formed on or above the second diffusion barrier layer. A manufacturing method for producing a bump is also provided.
Claims14
A bump including a diffusion bather bi-layer, the bump comprising:
- a conductive layer;
- a first diffusion barrier layer formed on or above the conductive layer, and comprising an alloy of nickel and phosphorus;
- a second diffusion barrier formed on or above the first diffusion barrier layer, and comprising copper;
- and
- a solder layer formed on or above the second diffusion barrier layer.
A manufacturing method of a bump including a diffusion barrier bi-layer, the method comprising:
- forming a conductive layer by depositing copper on or above an object in an electroplating method;
- forming a first diffusion barrier layer by depositing an alloy of nickel and phosphorus on or above the conductive layer in an electroless-plating method;
- forming a second bather layer by depositing copper on or above the first diffusion barrier layer in an electroplating method;
- and
- forming a solder layer by depositing tin (Sn) on or above the second diffusion barrier layer.
Dependencies are inferred from the claim text.