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US 2013/0154086 A1Published application
Exposing Connectors in Packages Through Selective Treatment
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Chung-Shi Liu, Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng
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Abstract
A method includes performing an etching step on a package. The package includes a package component, a connector on a top surface of the package component, a die bonded to the top surface of the package component, and a molding material molded over the top surface of the package component. The molding material covers the connector, wherein a portion of the molding material covering the connector is removed by the etching step, and the connector is exposed.
Claims20
A method comprising:
- performing an etching step on a package, wherein the package comprises:
- a package component;
- a connector on a top surface of the package component;
- a die bonded to the top surface of the package component;
- and
- a molding material molded over the top surface of the package component, wherein the molding material covers the connector, wherein a portion of the molding material covering the connector is removed by the etching step, and wherein the connector is exposed after the etching step.
3 more elements
A method comprising:
- bonding a die to a top surface of a package substrate, wherein the package substrate comprises a plurality of solder regions on the top surface;
- molding a molding material over the top surface of the package substrate, wherein the molding material covers the plurality of solder regions, and wherein the molding material comprises a polymer;
- and
- performing a treatment to remove a portion of the molding material covering the solder region, wherein after the treatment, a top portion of each of the plurality of solder regions is exposed, wherein an entirety of a top surface of a portion of the molding material is lower than top ends of the plurality of solder regions, and wherein the portion of the molding material is between two neighboring ones of the plurality of solder regions.
1 more element
A device comprising:
- a package component;
- a die bond to a top surface of the package component;
- a plurality of solder regions disposed on the top surface of the package component;
- and
- a molding material disposed over the top surface of the package component, wherein lower portions of the plurality of solder regions are disposed in the molding material, and wherein an entirety of a top surface of the molding material between two neighboring ones of the plurality of solder regions is lower than top ends of the plurality of solder regions.
2 more elements
Dependencies are inferred from the claim text.