Integrated circuit packaging system with heat conduction and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsDaeSik Choi, SangMi Park, MinJung Kim, MinWook Yu
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; mounting a lid base over the substrate, the lid base having a base indentation and a hole with the integrated circuit within the hole; and mounting a heat slug over the lid base, the heat slug having a slug non-horizontal side partially within the base indentation.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate;
- mounting an integrated circuit over the substrate;
- mounting a lid base over the substrate, the lid base having a base indentation and a hole with the integrated circuit within the hole;
- and
- mounting a heat slug over the lid base, the heat slug having a slug non-horizontal side partially within the base indentation.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate;
- mounting an integrated circuit over the substrate;
- mounting a lid base over the substrate, the lid base having a base indentation and a hole with the integrated circuit within the hole;
- attaching a thermal interface layer to the lid base;
- and
- mounting a heat slug directly on the thermal interface layer, the heat slug having a slug non-horizontal side partially within the base indentation.
An integrated circuit packaging system comprising:
- a substrate;
- an integrated circuit over the substrate;
- a lid base over the substrate, the lid base having a base indentation and a hole with the integrated circuit within the hole;
- and
- a heat slug over the lid base, the heat slug having a slug non-horizontal side partially within the base indentation.
Dependencies are inferred from the claim text.