Semiconductor module

A semiconductor module comprising:

• a semiconductor device;
• a metal plate portion that includes a first surface on a side of the semiconductor device;
• a molded portion that is formed by molding a resin on the semiconductor device and the metal plate portion;
• a cooling plate portion that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins on a side opposite to the side of the metal plate portion;
• a heat sink part that is provided between the semiconductor device and the first surface of the metal plate portion on the side of the semiconductor device;
• and
• an insulating material that is provided between the heat sink part and the first surface of the metal plate portion on the side of the semiconductor device;
• the heat sink part and the insulating material are disposed in the molded portion
• the insulating material includes an end that extends outwardly with respect to an end of the heat sink part, and
• the fins of the metal plate portion are formed at a center side with respect to the end of the heat sink part.

A semiconductor module comprising:

• a semiconductor device;
• a metal plate portion that includes a first surface on a side of the semiconductor device and has a fastening portion at an end thereof;
• a molded portion that is formed by molding a resin on the semiconductor device and the metal plate portion;
• and
• a cooling plate portion that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins on a side opposite to the side of the metal plate portion;
• wherein the fastening portion of the metal plate portion is exposed out of the molded portion, and the cooling plate portion includes a fastening portion at a position that corresponds to a position of the fastening portion of the metal plate portion, and
• the metal plate portion and the cooling plate portion are fastened to a channel forming member at the fastening portion of metal plate portion and the fastening portion of cooling plate portion, the channel forming member forming a cooling medium channel in which a cooling medium flows.