Semiconductor module

A semiconductor module comprising:

• a semiconductor device;
• a wiring member that is connected to the semiconductor device;
• a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction;
• a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, a heat sink part that is provided between the semiconductor device and the first surface of the cooling plate on the side of the semiconductor device;
• and
• an insulating material that is provided between the heat sink part and the first surface of the cooling plate on the side of the semiconductor device;
• wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction,
• the heat sink part and the insulating material are disposed in the molded portion
• the cooling plate includes fins on the second surface,
• the insulating material includes an end that extends outwardly with respect to an end of the heat sink part, and
• the fins of the cooling plate are formed at a center side with respect to the end of the heat sink part.