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US 2013/0154079 A1Published application
Integrated circuit packaging system with substrate mold gate and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsOh Han Kim, Haengcheol Choi, KyungOe Kim
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a mold gate on an upper surface of the substrate; mounting an integrated circuit to the substrate; and forming an encapsulant encapsulating the integrated circuit, the encapsulant having disruption patterns emanating from the mold gate and underneath a bottom plane of the integrated circuit.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate;
- forming a mold gate on an upper surface of the substrate;
- mounting an integrated circuit to the substrate;
- and
- forming an encapsulant encapsulating the integrated circuit, the encapsulant having disruption patterns emanating from the mold gate and underneath a bottom plane of the integrated circuit.
2 more elements
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate;
- forming a mold gate on an upper surface of the substrate;
- mounting an integrated circuit to the substrate;
- forming an encapsulant encapsulating the integrated circuit, the encapsulant having disruption patterns emanating from the mold gate and underneath a bottom plane of the integrated circuit, and a flat side in direct contact with the mold gate;
- and
- connecting external interconnects below the substrate.
3 more elements
An integrated circuit packaging system comprising:
- a substrate;
- a mold gate formed on an upper surface of the substrate;
- an integrated circuit mounted to the substrate;
- and
- an encapsulant encapsulating the integrated circuit and having disruption patterns emanating from the mold gate and underneath a bottom plane of the integrated circuit.
2 more elements
Dependencies are inferred from the claim text.