Chip package and method for forming the same

A chip package, comprising:

• a substrate having a first surface and a second surface;
• a device region formed in the substrate or disposed on the substrate;
• a dielectric layer disposed on the first surface of the substrate;
• at least one conducting pad disposed in the dielectric layer and electrically connected to the device region;
• a planar layer disposed on the dielectric layer;
• a transparent substrate disposed on the first surface of the substrate;
• a first spacer layer disposed between the transparent substrate and the planar layer;
• and
• a second spacer layer disposed between the transparent substrate and the substrate, wherein the second spacer layer comprises a main portion and an extending portion, and the extending portion covers a surface of the main portion and extends onto an opening of the dielectric layer to contact with the conducting pad.

A method for forming a chip package, comprising:

• providing a substrate having a first surface and a second surface, wherein a device region is formed in the substrate or disposed on the substrate, a dielectric layer is disposed in the first surface of the substrate, at least one conducting pad is disposed in the dielectric layer and electrically connected to the device region, and a planar layer is disposed on the dielectric layer;
• providing a transparent substrate;
• forming a patterned spacer layer on a surface of the transparent substrate, wherein the patterned spacer layer comprises a first spacer layer and a second spacer layer, the first spacer layer surrounds a region on the transparent substrate, and the second spacer layer surrounds the first spacer layer;
• disposing a spacer layer material on an upper surface of the second spacer layer;
• and
• disposing the substrate on the transparent substrate, wherein the first spacer layer directly contacts with the planar layer, and the spacer layer material bonds with the dielectric layer and fills an opening of the dielectric layer to contact with the conducting pad.