Semiconductor stack packages and methods of fabricating the same
AssigneeSK hynix Inc.
InventorTac Keun OH
Life of this patent
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Abstract
Semiconductor chip stacks are provided. The semiconductor chip stack includes a semiconductor chip stack including a plurality of first semiconductor chips vertically stacked on a top surface of the interposer, a second semiconductor chip stacked on a bottom surface of the interposer opposite to the semiconductor chip stack, and an external electrode attached to a top surface of the second semiconductor chip opposite to the interposer. Electronic systems including the semiconductor chip stack and related methods are also provided.
Claims15
A semiconductor stack package, comprising:
- an interposer;
- a semiconductor chip stack including a plurality of first semiconductor chips vertically stacked on a top surface of the interposer;
- a second semiconductor chip stacked on a bottom surface of the interposer opposite to the semiconductor chip stack;
- and
- an external electrode attached to a top surface of the second semiconductor chip opposite to the interposer.
A semiconductor stack package, comprising:
- an interposer in which a first through electrode is inserted;
- a semiconductor chip stack including a plurality of first semiconductor chips vertically stacked on a top surface of the interposer;
- a second through electrode that penetrates the semiconductor chip stack to be electrically connected to the first through electrode;
- a second semiconductor chip on a bottom surface of the interposer;
- and
- a third through electrode that penetrates the second semiconductor chip to be electrically connected to the first through electrode.
A method of fabricating a semiconductor stack package, the method comprising:
- vertically stacking a plurality of first semiconductor chips on a top surface of an interposer to form a semiconductor chip stack;
- and
- stacking a second semiconductor chip on a bottom surface of the interposer opposite to the semiconductor chip stack.
Dependencies are inferred from the claim text.