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US 2013/0154073 A1Published application
Method of forming a semiconductor device and leadframe therefor
AssigneeSemiconductor Components Industries, LLC
InventorsHarold L. Massie, Phillip Celaya, David F. Moeller, Mark Randol
Life of this patent
Estimating the term…
Abstract
In one embodiment, a leadframe for a semiconductor package includes a source connection area for one transistor and a drain connection point for a second transistor, and a common connection for using a connection clip to couple a drain of the first transistor to a source of the second transistor and to the common connection.
Claims20
A semiconductor device comprising:
- a leadframe for receiving semiconductor die, the leadframe having a first die attachment area for receiving a first semiconductor die, having a second die attachment area for receiving a second semiconductor die;
- the first semiconductor die having a first MOS transistor, the first MOS transistor having a source mechanically attached to the first die attachment area;
- the second semiconductor die having a second MOS transistor, the second MOS transistor having a drain mechanically attached to the second die attachment area;
- and
- a connection clip mechanically and electrically connected to the drain of the first MOS transistor, to the source of the second MOS transistor, wherein a first portion of the connection clip extends to attach to both the first and second semiconductor die and wherein a second portion of the connection clip extends away from the first portion to provide an electrical connection to the drain of the first MOS transistor, to the source of the second MOS transistor.
2 more elements
A method of forming a connection clip for interconnecting a plurality of semiconductor die comprising:
- forming a first portion of the connection clip having first and second surfaces that extend co-parallel in a first direction;
- forming a first connection pad on the first surface, the first connection pad having an area for electrically and mechanically connecting to a first semiconductor die;
- forming a second connection pad on the first surface, the second connection pad having an area for electrically and mechanically connecting to a second semiconductor die wherein the connection clip also forms an electrical connection between the first and second connection pads;
- and
- forming a second portion of the connection clip extending in a plane and at an angle away from the first portion of the connection clip including forming the second portion of the connection clip electrically connected to the first and second connection pads.
2 more elements
A method of forming a semiconductor package comprising:
- forming a leadframe having a first die attachment area for mechanically attaching to a first current carrying electrode of a first transistor, having a second die attachment area for mechanically attaching to a first current carrying electrode of a second transistor;
- and
- forming the semiconductor package with a connection clip configured to electrically couple a second current carrying electrode of the first and second transistors to a terminal of the semiconductor package.
Dependencies are inferred from the claim text.