Semiconductor package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsTae Hoon Kim, Seog Moon Choi
Life of this patent
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Abstract
Disclosed herein is a semiconductor package. The semiconductor package includes: semiconductor elements, a first heat dissipation substrate formed under the semiconductor elements, a first lead frame electrically connecting the lower portions of the semiconductor elements to an upper portion of the first heat dissipation substrate, a second heat dissipation substrate formed over the semiconductor elements, and a second lead frame having a protrusion formed to be protruded from a lower surface thereof and electrically connecting the upper portions of the semiconductor elements to a lower portion of the second heat dissipation substrate.
Claims20
A semiconductor package comprising:
- a plurality of semiconductor elements;
- a first heat dissipation substrate formed under the semiconductor elements;
- a first lead frame electrically connecting the lower portions of the semiconductor elements to an upper portion of the first heat dissipation substrate;
- a second heat dissipation substrate formed over the semiconductor elements;
- and
- a second lead frame having a protrusion formed to be protruded from one surface thereof to the outside and electrically connecting the upper portions of the semiconductor elements to a lower portion of the second heat dissipation substrate.
A semiconductor package comprising:
- a plurality of semiconductor elements each having the same thickness;
- a first heat dissipation substrate formed under the semiconductor elements;
- a first lead frame electrically connecting the lower portions of the semiconductor elements to an upper portion of the first heat dissipation substrate;
- a second heat dissipation substrate formed over the semiconductor elements;
- and
- a second lead frame electrically connecting the upper portions of the semiconductor elements to a lower portion of the second heat dissipation substrate.
Dependencies are inferred from the claim text.