Back to results
US 2013/0154069 A1Published application
Semiconductor package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsTae Hoon Kim, Seog Moon Choi
Life of this patent
Estimating the term…
Abstract
Disclosed herein is a semiconductor package, including: a first heat dissipation substrate; a first lead frame that is formed on the first heat dissipation substrate by patterning; a first semiconductor device formed on the first lead frame; a second semiconductor device that is stacked on the first semiconductor device; a second lead frame that is patterned and bonded to the second semiconductor device; and a second heat dissipation substrate formed on the first lead frame.
Claims20
A semiconductor package comprising:
- a first heat dissipation substrate;
- a first lead frame that is formed on the first heat dissipation substrate by patterning;
- a first semiconductor device formed on the first lead frame;
- a second semiconductor device that is stacked on the first semiconductor device;
- a second lead frame that is patterned and bonded to the second semiconductor device;
- and
- a second heat dissipation substrate formed on the first lead frame.
4 more elements
A semiconductor package comprising:
- a first heat dissipation substrate;
- a first lead frame that is formed on the first heat dissipation substrate by patterning;
- a first semiconductor device formed on the first lead frame;
- a second semiconductor device that is stacked on the first semiconductor device;
- a second lead frame that is patterned and bonded to the second semiconductor device;
- a second heat dissipation substrate formed on the first lead frame;
- a third lead frame that is formed on the second heat dissipation substrate by patterning;
- a third semiconductor device formed on the third lead frame;
- a fourth semiconductor device that is stacked on the third semiconductor device;
- a fourth lead frame that is patterned and bonded to the fourth semiconductor device;
- and
- a third heat dissipation substrate formed on the fourth lead frame.
9 more elements
Dependencies are inferred from the claim text.