US 2013/0154062 A1 · Die Structure and Method of Fabrication Thereof

Abstract

A die having a ledge along a sidewall, and a method of forming the die, is provided. A method of packaging the die is also provided. A substrate, such as a processed wafer, is diced by forming a first notch having a first width, and then forming a second notch within the first notch such that the second notch has a second width less than the first width. The second notch extends through the substrate, thereby dicing the substrate. The difference in widths between the first width and the second width results in a ledge along the sidewalls of the dice. The dice may be placed on a substrate, e.g., an interposer, and underfill placed between the dice and the substrate. The ledge prevents or reduces the distance the underfill is drawn up between adjacent dice. A molding compound may be formed over the substrate.

Claims20

Dependent claims

A method comprising:

providing a substrate;
forming a first notch between a first region and a second region, the first notch having a first width;
forming a second notch within the first notch, the second notch having a second width less than the first width, thereby forming a ledge, the second notch extending through the substrate, thereby dicing the substrate into separate dice;
placing one or more of the dice onto a second substrate such that the ledge is opposite the second substrate;
and
placing an underfill between the one or more of the dice and the second substrate, an upper surface of the underfill being at the ledge.

3 more elements

Dependencies are inferred from the claim text.

Die Structure and Method of Fabrication Thereof

Life of this patent

Die Structure and Method of Fabrication Thereof

Life of this patent

Abstract

Claims20