Anodizing apparatus, an anodizing system having the same, and a semiconductor wafer

An anodizing apparatus for causing an anodizing reaction to substrates immersed in an electrolyte solution, comprising:

• a storage tank for storing the electrolyte solution;
• a holding device for forming a hollow portion therein having a section of similar shape to the substrates, and holding the substrates with circumferential surfaces of the respective substrates placed in a liquid-tight state;
• a pair of electrodes arranged at opposite ends of the hollow portion formed in the holding device;
• an electric circuit for applying direct current to the pair of electrodes;
• and
• a moving mechanism for moving the holding device between a transfer position outside the storage tank and a treating position inside the storage tank;
• wherein chemical reaction treatment is carried out with the circumferential surfaces of the substrates placed in the liquid-tight state and electrically separated and insulated, by moving the holding device holding the substrates to the treating position, and filling the hollow portion with the electrolyte solution, and after the chemical reaction treatment is completed, the holding device is moved from the treating position to unload the substrates from the storage tank.