Integrated Circuit and IC Manufacturing Method

A method of manufacturing an integrated circuit die, comprising:

• providing a carrier;
• forming an active substrate on said carrier;
• forming a plurality of isolation structures in said active substrate, thereby defining a plurality of active regions laterally separated by said isolation structures;
• forming a plurality of components in respective ones of said active regions;
• forming a plurality of serially connected polysilicon resistors on respective ones of said isolation structures;
• and
• electrically insulating the respective portions of the active substrate underneath said isolation structures from the components.