Light-emitting element mounting package, light-emitting element package, and method of manufacturing the same

A method of manufacturing a light-emitting element mounting package, the method comprising:

• laminating a metallic layer on an insulating layer;
• forming a light-emitting element mounting portion, in which a plurality of wiring portions are separated by predetermined gaps, by removing predetermined portions of the metallic layer;
• forming a bus line for electrically connecting the plurality of the wiring portions;
• forming a light-emitting element mounting area on the wiring portions, the light-emitting element mounting area including a pair of electroplating films, the pair of electroplating films being formed by electroplating using the bus line;
• removing the bus line after forming the light-emitting element mounting area;
• wherein, in the forming the light-emitting element mounting area, the pair of electroplating films are formed such that one of the pair of electroplating films belongs to one of the pair of wiring portions and another of the pair of electroplating films belongs to another of the pair of wiring portions.

A light-emitting element mounting package comprising:

• an insulating layer;
• a light-emitting element mounting portion, in which a plurality of wiring portions are formed on the insulating layer and separated by predetermined gaps;
• a light-emitting element mounting area including a pair of electroplating films, which are formed on predetermined areas of mutually adjacent wiring portions of the plurality of wiring portions;
• wherein one of the pair of electroplating films belongs to one of the mutually adjacent wiring portions and another of the pair of electroplating films belongs to another of the mutually adjacent wiring portions.