Light emitting device, circuit board, packaging array for light emitting device, and method for manufacturing packaging array for light emitting device

A circuit board, comprising:

• a light emitting device;
• a mounting board on which the light emitting device is mounted;
• and
• a first solder fillet and a second solder fillet disposed on the mounting board,
• the light emitting device having:
• a light emitting element;
• and
• a package constituted by a molded article and a lead embedded in the molded article,
• the lead including a mounting part, a terminal part and an exposed part, the light emitting element being mounted on the mounting part, the terminal part being linked to the mounting part,
• the package having a light emission face, a rear face opposite to the light emission face, and a bottom face communicating the light emission face and the rear face,
• the light emitting element mounted on a light emission face side of the mounting part,
• the exposed part linked to a rear face side of the mounting part, the exposed part being exposed from the molded article at the bottom face and the rear face,
• the terminal part exposed from the molded article at the bottom face
• the first solder fillet connected to the terminal part and the mounting board, and
• the second solder fillet connected to the exposed part and the mounting board.

A package array for a light emitting device, comprising:

• a molded board made of resin;
• and
• a lead frame embedded in the molded board, the lead frame formed in a thin plate shape, the lead frame having a first frame component and a second frame component adjacent to the first frame component in a specific direction,
• the first frame component and the second frame component each including:
• a first thick part exposed from the molded board with a first thickness;
• a second thick part exposed from the molded board with the first thickness, the second thick part separated from the first thick part in the specific direction;
• a first thin part linked to the first thick part and the second thick part with a second thickness less than the first thickness;
• and
• a second thin part linked to the second thick part with the second thickness, the second thin part separated from the first thin part in the specific direction.

A method for manufacturing a package array for a light emitting device, comprising:

• a double-sided etching step of forming etching holes in a thin metal plate by etching a first main face and a second main face opposite to the first main face of the thin metal plate;
• a one-sided etching step of forming a lead frame in a specific shape by forming an etching concave component in a second pattern on the first main face, the etching concave component is formed by etching part of the first main face of the thin metal plate;
• and
• a molding step of forming a molded board in which the lead frame is embedded by injecting resin into a metal mold in which the lead frame is disposed, wherein
• the lead frame has a thick part that constitutes an exposed part linked to a mounting part for mounting a light emitting element, and a thin part that constitutes a connected part separated from the mounting part with the etching holes in between.