Chip package and method for forming the same

A method for forming a chip package, comprising:

• providing a semiconductor wafer having a first surface and a second surface, wherein a plurality of sensor regions are formed in the semiconductor wafer;
• disposing a plurality of light emitting devices on the second surface of the semiconductor wafer;
• forming an insulating layer on the first surface of the semiconductor wafer;
• forming a plurality of first conducting bumps on the insulating layer on the first surface of the semiconductor wafer, wherein each of the plurality of first conducting bumps is electrically connected to a corresponding one of the plurality of sensor regions;
• forming a plurality of second conducting bumps on the insulating layer on the first surface of the semiconductor wafer, wherein each of the plurality of second conducting bumps is electrically connected to a corresponding one of the plurality of light emitting devices;
• and
• performing a dicing process along a plurality of predetermined scribe lines of the semiconductor wafer to form a plurality of chip packages separated from each other, wherein each of the plurality of chip packages comprises at least one of the plurality of sensor regions and at least one of the plurality of light emitting devices.