Process for preparing an organic electronic device

Process for preparing an organic electronic device, comprising the steps of

• depositing an insulator layer comprising a cross-linkable dielectric material onto a substrate or onto another layer of said OE device,
• exposing one or more areas of the insulator layer to a first radiation dosage, or to a first thermal energy, that causes partial but not complete cross-linking of the dielectric material,
• exposing one or more, but not all, areas of the insulator layer to a second radiation dosage, or to a second thermal energy, that causes a higher degree of cross-linking of the dielectric material than the exposure to the first radiation dosage or the first thermal energy,
• wherein the sequence of the two exposure steps can also be reversed,
• depositing an organic semiconductor (OSC) layer onto at least a part of the insulator layer,
• so that the OSC layer is in direct contact with at least a part of the areas of the insulator layer having a higher degree of cross-linking of the dielectric material.