Surface sealant for optical semiconductor, method for manufacturing organic el device, organic el device and organic el display panel using the same

A surface sealant for an optical semiconductor, comprising:

• an epoxy resin (a) having two or more epoxy groups in a molecule thereof;
• and a curing accelerator (b2) represented by the following general formula (11) or (12),
• wherein the surface sealant has a viscosity of 10 to 10000 mPa·s, as measured by E-type viscometer at 25° C. and 1.0 rpm,
• where R1, R2, R3 and R4 each independently represent a hydrogen group, a C1-17 aliphatic hydrocarbon group, a hydroxy group, an aryl-containing group or a cyanoethyl group;
• with the proviso that when R1 is a hydrogen group, one or both of R2 and R4 are aryl groups;
• where RA1, RA2, RA3 and RA4 each independently represent a hydrogen group, a C1-17 aliphatic hydrocarbon group, a hydroxy group, an aryl-containing group or a dimethylaminomethyl group;
• with the proviso that one or more groups of RA1, RA2, RA3 and RA4 are dimethylaminomethyl groups.

An organic EL device comprising:

• an organic EL element;
• a cured material layer that seals a surface of the organic EL element and is formed of an epoxy resin composition, a spectrum of X-ray photoelectron spectroscopy (XPS) of the epoxy resin composition includes a peak derived from at least one metal atom selected from the group consisting of Zn, Bi, Ca, Al, Cd, La and Zr and a peak derived from a nitrogen atom, with a molar ratio of the metal atom to the nitrogen atom being 1:0.5 to 1:6.0, the cured material layer containing the metal atom in an amount of 0.5 to 15 mass %;
• and
• a passivation layer in contact with the cured material layer.