Conductive elements in organic electronic devices
AssigneePlastic Logic Limited
InventorsRicardo Mikalo, Anja Wellner, Jens Dienelt, Patrick Too
Life of this patent
Estimating the term…
Abstract
A technique comprising: forming a conductive element of an electronic device on a portion of the surface of a first organic layer, applying a second organic layer over said conductive element and said first organic layer, and then treating at least one of the first and second organic layers to increase the strength of adhesion between said first and second organic layers. Thereby the retention of said conductive element on said first organic layer is improved.
Claims13
A method comprising:
- forming a conductive element of an electronic device on a portion of the surface of a first organic layer, applying a second organic layer over said conductive element and said first organic layer, and then treating at least one of the first and second organic layers to increase the strength of adhesion between said first and second organic layers and thereby improve the retention of said conductive element on said first organic layer.
10-15. (canceled)
The use of a noble metal for a gate line in an organic thin-film transistor for the purpose of reducing gate-line breaks.
The use of a noble metal for a gate line above a solution-processed organic gate dielectric layer having a thickness of no greater than about 300 nm.
18-19. (canceled)
Dependencies are inferred from the claim text.